DOIT

DOW CORNING EA 6900

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DOW CORNING EA 6900

Insulation Adhesive, High temperature lidseal and heat sink attach adhesive designed for Pb-free reflow conditions such as 260C.
Product information
Characteristics: high strength / good adhesion
Market Application: Semiconductor
Market Application 2: Optical Components
Colour: Black
Certification: No
Brand: DOW CORNING

Detail

Appearance color: transparent


Viscosity (MPa. S): 45000


Temperature resistance range (℃): - 45 ℃ ~ + 200 ℃


Storage conditions: & lt; 10 ℃ @ 12months


Hardness (Shore): A28


Package: 1kg


Product application: chip protection


Application scope: cob process


Curing condition: 60mins @ 150 & deg; C


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