DOIT Office Relocation Notice – 2025

About us

• Company profile

• Corporate culture

• Honor

Products

• Photoelectricity

  • Solid crystal material

  • Methyl sealant

  • Methyl phenyl sealant

  • Phenyl encapsulation

  • Highly reflective material

  • Reinforcing material for wire arrangement

• Semiconductor

  • Wafer fixing

  • Wafer protection

  • Wafer direct packaging

  • Thermal management

  • Smart card packaging

  • New solder paste

  • Solder ball protection

  • Electromagnetic wave

  • Bottom filling molding

  • Connecting material of radiator and bracket

  • Flattening process material

• New energy

  • Ointment

  • Antifriction coating

  • Grease

  • Complex

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• DoIt news

• Product news

Support

• Common problem

• Message

ESG

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